Blar i SINTEF Open på forfatter "Beekley, Brett"

Viser treff 1-2 av 2

    • Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding 

      Goorsky, Mark S.; Schjølberg-Henriksen, Kari; Beekley, Brett; Bai, Tingyu; Mani, Karthick; Ambhore, Pranav; Bajwa, Adeel; Malik, Nishant; Iyer, Subramanian S. (Journal article; Peer reviewed, 2017)
      Au-Au thermocompression bonding is a versatile technique of high interest for a variety of applications. We have investigated Au-Au bonding using sputter deposited Au films under conditions of low temperature (150-250 °C) ...

    • The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au 

      Ambhore, Pranav; Mani, Karthick; Beekley, Brett; Malik, Nishant; Schjølberg-Henriksen, Kari; Iyer, Subramanian S.; Goorsky, Mark S. (Peer reviewed; Journal article, 2018)
      Abstract Au-Au thermocompression bonding is a widely used technique for a variety of applications including hermetic sealing and packaging at a fine pitch. We have investigated the roles of pressure and temperature ...